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The phyFLEX-i.MX6 SOM supports the NXP i.MX6 Solo, i.MX6 Dual, and i.MX6 Quad application processors offering a broad range of solutions with emphasis from cost-efficiency to high demand performance at low power. The three innovative SOM interconnects provide standardization across the phyFLEX product family and highlight features such as 64-bit DDR3, USB, Gigabit Ethernet, integrated FlexCAN and MLB busses, PCIe, SATA-II, multiple simultaneous displays, camera interface, and HDMI v1.4.

Take a closer look

The phyFLEX-i.MX6 System on Module


The i.MX6 Cortex-A9 Processor Family

The NXP i.MX6 Series includes a highly scalable family of embedded processors based on ARM® Cortex™-A9 technology with single-, dual-, and quad-core offerings delivering up to 1.2 GHz per core. Along with power-efficient processing capabilities, the i.MX6 Series of application processors provide a leading edge 3D graphics engine, stereoscopic image sensor support for 3D imaging, HD video engine delivering 1080p encode/decode, 3D video playback, and separate 2D engine for UI.

SOM Highlights

  • i.MX6 Single, Dual, Quad core
  • Up to 1.2 GHz / core
  • VPU, IPUv3H, GPU2Dv2, OpenVG 1.2
  • Up to 4 GB DDR3 / 16 GB NAND
  • USB 2.0 OTG and Host
  • CAN, UART, SPI, I2C, I2S
  • Camera interface
  • Up to 4 displays + HDMI
  • Linux and Compact 7 BSPs
Feature Details
Part Number PFL-A-02
Architecture ARM® Cortex™-A9
Processor Freescale i.MX6: Single, Dual, Quad core
Frequency 1.2 GHz / core
DRAM 1 GB default / 4 GB max DDR3
NAND 1 GB default / 16 GB max
NOR 16 MB max
PCIe 1x 2.0
I2C 2
I2S 1
USB Host 1x HS 2.0
USB Device
USB OTG 1x HS 2.0
Ethernet (Mbit/s) 10/100/1000
Audio Yes
Graphics OpenVG 1.2
Video 1080p60 decode, 1080p30 encode
Display 2x LVDS, 1x TTL, HDMI
Touch External
Camera 2x LVDS or CPI, 1x MIPI CSI
Miscellaneous EMIC (fan management), PWM, Keypad, JTAG
Dimensions 60 x 70 mm
Connector 380-pin 0.5 mm pitch
Supply Voltage 5.0 V
Power Consumption tbd
Temperature -40° to +85° C

The Interconnect

phyFLEX-i.MX6 interfaces are routed to our high-density PCB interconnects on the underside of the SOM. Design the mating connectors on your carrier board. 

The phyFLEX-i.MX6 Rapid Development Kit

Kit Contents

  • phyFLEX-i.MX6 System on Module
  • phyFLEX Carrier Board
  • Linux or Compact 7 Software
  • Optional phyFLEX-i.MX6 Mapper Board
  • Optional LCD
  • Optional WiFi module
  • Cables, schematics, and kit CD

The phyFLEX SOM provides a flexible platform designed to plug into the PHYTEC phyFLEX base Carrier Board providing a standard set of physical I/O connectors as well as any other interface circuitry not provided on the phyFLEX module itself. Connect the optional phyFLEX Mapper Board between the phyFLEX SOM and phyFLEX Carrier Board for interfaces to processor specific features.

Carrier Board Features

  • 2x RJ-45 Ethernet jack
  • WiFi / Bluetooth module connector
  • 2x RS-232 serial ports
  • USB-OTG interface
  • 2x USB 2.0 Host port
  • 2x SD/MMC card slots
  • CAN connector
  • Stereo input and output jacks
  • LVDS / touch display interface
  • HDMI / DVI interface
  • 2x LVDS camera interfaces
  • RTC backup battery
  • JTAG connector

SOM Features

The phyFLEX-i.MX6 SOM included in the phyFLEX-i.MX6 kit features: Freescale i.MX 6 Quad processor @ 4 x 1 GHz, 1 GB DDR3, 1 GB NAND Flash, 16 MB SPI-NOR Flash, 4 KB EEPROM, Gigabit Ethernet PHY, and industrial temperature rating.

Optional Accessories

  • Choose from a 5“, 7”, or 10” VGA LVDS display with 4-wire touchscreen
  • Mapper Board provides a breakout of the additional functionality offered on the optional connector that is not common to the phyFLEX standard
  • TiWi R2 WiFi module that plugs right into the phyBASE

phyFLEX-i.MX6 Board Support Packages

PHYTEC Board Support Packages (BSPs) are software bundles that implement and support operating systems on our System on Modules. PHYTEC BSPs are application development-ready, offering all essential drivers and board-level feature support. The only task left for you is application integration. This way, you can focus on your core competencies while we take care of the rest.

Linux Package

  • GCC C/C++ cross development tool chain
  • Eclipse IDE
  • PTXdist build system
  • Bootloader, kernel, file system
  • Source BSP

Access BSP here

Compact 7 Package

  • Visual Studio 2008 evaluation CD 
  • Platform Builder 7 
  • SDK for application development 
  • Bootloader and runtime Nk.bin image 
  • OSDesign example 
  • Binary BSP, source available under EULA

Access BSP here


View PHYTEC certifications for ISO9001:2008, RoHS II, Conflict Minerals, and more here.

Developer Wiki

Find Quickstart guides, BSP downloads, and other useful information on our wiki.


Welcome to PHYTEC support! We pride ourselves in our excellent customer service. If you cannot find the help you need here, please call us and we will connect you with a live person who can assist you.

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