phyCORE-i.MX 8X

dimensions icon white
52 mm x 42 mm
cpu icon white
Cortex®-A35
Cortex®-M4F
Processor icon white
Tensilica® HiFi 4 DSP
speaker icon white
Vulkan
4K h.265 decode
1080P h.264 encode

Safety, Security and Digital Signal Processing

The phyCORE-i.MX 8X System on Module supports the NXP i.MX 8X family of applications processors. It offers efficient and scalable processing power. In addition, the Tensilica HiFi 4 DSP and GPU are available for additional acceleration and processing power. The phyCORE-i.MX 8X SOM is designed to be used for general purpose embedded control tasks with a good price-performance ratio. 

PHYTEC phyCORE-i.MX 8X System on Module top view

The i.MX 8X Processor

NXP i.MX 8X Icon black

The NXP i.MX 8X family of application processors provide a vast offering of solutions with respect to features and performance. The QuadXPlus, DualXPlus, and DualX platforms are based on Arm® Cortex®-A35, and Cortex-M4F. 

NXP i.MX 8X Block Diagram

High-density PCB interconnects

i.MX 8X interfaces are routed to our high-density PCB interconnects on the underside of the SOM. Design the mating connectors on your carrier board.

DSP and multimedia processing

The NXP i.MX 8X features a Tensilica® HiFi 4 DSP. Utilize this for advanced audio and image processing for your application. In addition to the discrete DSP the NXP i.MX 8X supports OpenGL 3.1, OpenCL 1.2 EP, OpenVG 1.1, Vulkan, 4K h.265 decode and 1080p h.264 encoding. 

Software that is specifically designed for its hardware

PHYTEC Board Support Packages (BSPs) are software bundles that implement and support operating systems on our System on Modules. PHYTEC BSPs are application development-ready, offering all essential drivers and board-level feature support. The only task left for you is application integration. This way, you can focus on your core competencies while we take care of the rest.

Small footprint for small enclosures

With dimensions of 52 x 42 mm it is well suited for small enclosures. 

 

PHYTEC phyCORE-i.MX 8X System on Module top view

SOM Specification Overview

Processor

NXP i.MX 8DualX, NXP i.MX 8DualXPlus, NXP i.MX 8QuadXPlus

Processor Hz

1.2 GHz

Architecture

Arm Cortex-A35, Arm Cortex-M4F

ADC

6

Audio

ESAI

Camera Interface

1x MIPI CSI, Parallel

Connector

280-pin 0.5 mm pitch

Dimensions

52 x 42 mm

Display Interfaces

2x LVDS or 2x MIPI DSI, parallel

DSP

1x Tensilica® HiFi4

EEPROM

4 KB

Ethernet

2x 10/100/1000

eMMC

4GB default / 128GB max

Graphics

16 Vec4-Shader GPU

I2C

Up to 10

RAM

4 GB max LPDDR4

NAND

128 MB up to 1 GB max (optional eMMC)

NOR

64 MB up to 256 MB (Octal SPI/Dual SPI Flash)

Operational Temperature

-40° to +85° C

PCIe

1x PCIe 2.0

RTC

Yes

SD/SDIO/MMC Interfaces

1 (only with eMMC)

Security Accelerators

3DES, AES, ECC Ciphers, RSA, SHA1/256, TRNG

SPI/SSP

1x Octal SPI or 2x Quad SPI, 3

Supply Voltage

3.3V

Touch

External

UART

2

USB OTG

1x OTG, 1x USB3.0

Video

1080p h.264 Encode, 4k h.265 Decode

Development Kits

Get in touch with PHYTEC about your project

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